Extreme Ultraviolet (EUV) Lithography is an optical lithography process that employs a variety of extreme ultraviolet (EUV) wavelengths.
Extreme Ultraviolet (EUV) Lithography |
Extreme Ultraviolet
(EUV) Lithography is a more sophisticated form of lithography that use
ultra violet light with the shortest wavelength of 13.5 nm. Lithography is
primarily used to print complex designs, most of which are highlight integrated
circuits, onto semiconductor wafers.
One of the factors driving the
growth of the Extreme
Ultraviolet (EUV) Lithography is the increasing usage of smartphones throughout the world.
Compact electronics chips are manufactured using extreme ultraviolet
lithography technique. These little chips are used to store memory in
cellphones and other items. As a result, the growing number of smartphone users
throughout the world is likely to drive market expansion over the forecast
period. According to the Australian Communications and Media Authority's
Communications Report (2018-19), in June 2019, 83 percent (roughly 16.4
million) of Australian adults had a smartphone.
On the supply chain side, the
lack of raw materials for component manufacture owing to the total lockdown is
a big impediment to industry expansion. Manufacturing enterprises were unable
to deliver items to the market due to delays in the delivery of raw materials
and components. As a result, the pandemic has an impact on the extreme
ultraviolet (EUV) lithography business.
As governments in several nations
ease lockdown restrictions, manufacturing is restarting; nevertheless,
enterprises are still functioning with partial personnel on the shop floor and
working from home. As a result, producers of different electrical and
semiconductor components are suffering manufacturing delays. However, high
pricing of extreme ultraviolet (EUV) lithography systems and low technological
acceptance are obstacles that may stymie extreme ultraviolet (EUV) lithography
growth.
Extreme ultraviolet lithography
(also known as EUV or EUVL) is an optical lithography process that uses a variety
of extreme ultraviolet (EUV) wavelengths to build a pattern by exposing a
reflective photomask to UV light, which is reflected onto a photoresist-covered
substrate. It is commonly used in the production of semiconductor devices. ASML
Holding is the sole business that manufactures and distributes EUV equipment
for chip fabrication, mostly at 5 nm, as of 2022. TSMC disclosed usage of EUV
for 5 nm in contact, via, metal line, and cut layers at the 2019 International
Electron Devices Meeting (IEDM), where the cuts may be applied to fins, gates,
or metal lines. At IEDM 2020, TSMC
reported their 5 nm minimum metal pitch to be reduced 30% from that of 7 nm,
which was 40 nm. Samsung's 5 nm is lithographically the same design rule as 7
nm, with a minimum metal pitch of 36 nm.
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